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Press Dewatering Board
Thermal Conductivity
(W/m*k) |
Coefficient of Thermal Expansion
(10-C/°C ) |
Vickers Hardness (Kg/mm2) |
Fracture Toughness
(Mpa.M1/2) |
Bending Strength
(Mpa) |
Bulk Density
(g/cm3) |
Material |
20-25 |
7.0-8.0 |
1450-1530 |
5.0-6.0 |
380-420 |
3.86-3.88 |
Sub-micron Aluminium Oxide
Sicer-Sub A |
2-3 |
9.0-10.0 |
1050-1100 |
9.0-10.0 |
700-800 |
5.65-5.75 |
Zirconium Oxide
Sicer-ZrO2(W) |
2-3 |
9.0-10.0 |
1200-1250 |
9.0-10.0 |
900-1000 |
6.0-6.05 |
Zirconium Oxide
Sicer-ZrO2(Y) |
30-50 |
2.5-3.0 |
1650-1750 |
6.0-6.7 |
650-750 |
3.05-3.20 |
Silicon Nitride
Sicer-Si3N4 |
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